光学測定機
UNITECHO revolutionizes dimensional metrology with our One-Key Measuring Instrument series, engineered to deliver instantaneous, micron-level measurements with the single push of a button. By combining double telecentric optics with advanced image processing algorithms, our systems eliminate operator error and drastically reduce inspection time compared to traditional projectors or calipers.
Our diverse product lineup caters to various industrial geometries and sizes. The Vertical Series (QMS) is designed for rapid inspection of flat components such as precision hardware, PCBs, and mobile phone glass, utilizing a high-depth-of-field telecentric lens to capture clear images without distortion. For shaft-type components like screws and medical bone nails, our Horizontal Series offers a specialized layout ideal for cylindrical measurements. Additionally, our Splice Series and QMQ Series feature large-field-of-view capabilities and automated image stitching technology, enabling the precise measurement of larger workpieces up to 500mm in size.
製品シリーズ
Revolutionizing precision with 20MP one-key measurement
Combines a massive 20-million-pixel sensor with Double Telecentric Optics to deliver sub-pixel accuracy (0.00001mm) in a single click. The OMQ series features automatic Z-axis movement and a 256-level programmable lighting system, ensuring consistent measurements for complex workpieces. Discover efficiency with the Vertical Series: high-speed detection meeting strict ±(2.5+L/50)μm precision standards.
✅ 20MP Sensor & Double Telecentric Lens for distortion-free imaging
✅ Intelligent IVT-VISION software with automatic Z-axis control
✅ High repeatability (±1.5μm) with flexible 256-level lighting
Redefining large-scale measurement with intelligent splicing
Automated platform movement, a massive 20-million-pixel sensor, and flexible lighting for precise measurement of large components. Suitable for extensive inspection requirements with travel ranges up to 500×400×200mm(OMQ542). Discover the power of the OMQ Splice Series: combining IVT-VISION analysis with double telecentric optics for distortion-free, sub-pixel accuracy across the entire stage.
✅ 20MP High-resolution sensor & Double Telecentric Lens
✅ Large measurement range (XYZ) with automatic table motion
✅ High static accuracy (±2.0μm) with optional 3D laser profiling
Entering the era of rapid horizontal metrology
Unmatched precision meets efficiency. The OMQ Horizontal Series combines a massive 20-million-pixel sensor with double telecentric optics to deliver distortion-free measurement in an instant. Powered by IVT-VISION software with 0.00001mm resolution, this system features automatic R-axis movement and advanced sub-pixel processing. It is the ideal solution for high-accuracy inspection across ranges up to 190×126mm.
✅ 20MP high-resolution sensor with Double Telecentric Lens
✅ Automatic R-axis and 256-level programmable lighting
✅ High precision [±(2.5+L/50)μm] with IVT-VISION analysis
製品比較
製品分類の利点
Instant High-Speed Measurement
Powered by advanced computing algorithms, the system can measure over 100 dimensions in under 1 second. This "flash" measurement capability drastically reduces inspection cycles compared to traditional optical projectors or calipers, making it ideal for high-volume production environments.
Effortless Operation & Elimination of Human Error
The system requires no specialized fixtures or precise part alignment. With arbitrary placement recognition, the software automatically identifies the workpiece's position and orientation. This "place-and-press" simplicity allows any operator to achieve consistent, repeatable results, effectively eliminating errors caused by manual handling or visual fatigue
Superior Optical Precision
Equipped with high-resolution 20-million-pixel cameras and double telecentric lenses, our instruments deliver distortion-free imaging with an exceptional depth of field. This optical setup ensures sharp edge detection even on parts with height variances (steps), guaranteeing accuracy without the need for constant refocusing.
Simultaneous Multi-Part Inspection
Designed for efficiency, the large field of view allows for the simultaneous measurement of multiple workpieces. The system can identify and measure dozens of small components—such as gears, screws, or springs—in a single frame, significantly boosting inspection throughput.
Intelligent Data Analysis & Reporting
Integrated SPC (Statistical Process Control) software automatically records data and generates real-time reports (Excel, Word, TXT). It calculates critical quality metrics like Cp and Cpk, enabling manufacturers to monitor process stability and trace quality history without manual data entry.
Advanced Stitching for Large Scale Components
For workpieces exceeding the standard field of view, our Splice Series utilizes high-precision automated platform movement and image stitching technology. This allows for the complete measurement of large parts (up to 500mm), such as mobile phone frames and PCBs, while maintaining micron-level accuracy across the entire measuring range.
業界アプリケーション・ショーケース
自動車産業
Targeting critical components such as precision gears, springs, fasteners, and stamping parts, our equipment guarantees the dimensional integrity of safety-critical automotive parts. The high-speed batch measurement capability supports near 100% inspection rates, ensuring strict tolerance adherence for vehicle assembly.
医療業界
We provide high-precision, non-contact measurement solutions for sensitive implants like medical bone nails and surgical instruments. Our systems accurately profile complex contours and threads without physical contact, ensuring compliance with the rigorous quality and hygiene standards of the medical sector.
エレクトロニクス産業
From mobile phone glass and SIM card slots to FPCs and laptop frames, our systems enable rapid, simultaneous measurement of multiple complex micro-dimensions. This solves the efficiency bottleneck of manual inspection, ensuring consistent quality for high-volume consumer electronics.
半導体産業
For products requiring extreme detail like PCBs, electronic tags, and IC lead frames, our sub-pixel processing technology detects minute dimensional deviations. The automated image stitching feature allows for complete inspection of large circuit boards, ensuring hole position accuracy and assembly reliability.
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ユナイトエコー・テクノロジー
UNITECHO株式会社は2013年に設立され、中国蘇州に本社を置く。マシンビジョンアル技術を核心とし、マシンビジョン、オートメーション、人工知能、その他の技術と産業アプリケーションを深く融合させることに力を注いでいる。研究開発、生産、販売、サービスに重点を置く新しいハイテク企業である。.
業界インサイト＆リソース
