縦型光学測定機

Revolutionizing precision with 20MP one-key measurement

Combines a massive 20-million-pixel sensor with Double Telecentric Optics to deliver sub-pixel accuracy (0.00001mm) in a single click. The OMQ series features automatic Z-axis movement and a 256-level programmable lighting system, ensuring consistent measurements for complex workpieces. Discover efficiency with the Vertical Series: high-speed detection meeting strict ±(2.5+L/50)μm precision standards.

✅ 20MP Sensor & Double Telecentric Lens for distortion-free imaging

✅ Intelligent IVT-VISION software with automatic Z-axis control

✅ High repeatability (±1.5μm) with flexible 256-level lighting

ソフトウェアの利点

Rapid Multi-Dimensional Measurement

The IVT-VISION software drastically reduces inspection time by measuring over 100 dimensions simultaneously in under 1 second. Unlike traditional methods, adding measurement points does not increase the cycle time, ensuring maximum throughput for high-volume production efficiency.

Intuitive Operation for Everyone

Measurement data is automatically saved and organized for centralized management, ensuring full traceability and easy retrieval. With a single click, users can generate detailed inspection reports, streamlining post-measurement workflows and significantly improving administrative efficiency.

Automated Data Management & Reporting

Measurement data is automatically saved and organized for centralized management, ensuring full traceability and easy retrieval. With a single click, users can generate detailed inspection reports, streamlining post-measurement workflows and significantly improving administrative efficiency.

No Fixturing or Precise Positioning Required

The system utilizes advanced pattern recognition to automatically detect the shape, position, and orientation of the workpiece. This eliminates the need for time-consuming alignment or expensive fixtures—simply place the part on the stage, and the software handles the rest.

Elimination of Focus-Related Errors

Featuring a large depth-of-field telecentric lens and auto-focus capabilities, the system handles uneven surfaces and height variations with ease. This technology eliminates deviations caused by manual focus adjustments, ensuring consistent accuracy regardless of the operator's skill level.

使用シナリオ

3c ハードウェア
バッテリー
カッター
型抜き
携帯電話カメラ
携帯電話ガラス
プリント基板
Rfidタグ
シムカードスロット
スペース・ダスト・シールド
プレス部品

自動車用プレス部品

The OMQ series is the perfect solution for verifying hole position deviations and profile contours on flat metal parts, ensuring precise fit and structural integrity in body and chassis components.

自動車用ゴムおよびシーリング部品

Its non-contact measurement capability prevents deformation when inspecting soft gaskets and seals, accurately identifying dimensional instability and verifying inner and outer diameters.

Automotive Plastic Parts & Structural Components

The system reliably detects warpage and verifies critical assembly dimensions on complex interior and exterior plastic parts.

自動車用ファスナー

It delivers rapid checks of head diameters, washer thickness, and thread profiles for fasteners placed flat on the stage.

3c ハードウェア
バッテリー
カッター
型抜き
携帯電話カメラ
携帯電話ガラス

電子構造部品

Leveraging Instant One-Key Measuring technology, the system verifies complex geometric tolerances—including flatness, hole positions, and profile contours—on smartphone mid-frames and SIM trays for slim, high-density devices.

電子金属金物

It precisely measures dimensional deviations in shielding cans and small flat hardware to ensure strict adherence to functional standards.

電子プラスチック部品

The equipment ensures defect-free dimensional quality on delicate keys and optical lenses, avoiding surface damage through non-contact inspection.

3c ハードウェア
バッテリー
カッター
型抜き
携帯電話カメラ
携帯電話ガラス
プリント基板
Rfidタグ
シムカードスロット
スペース・ダスト・シールド
プレス部品

半導体ウェハー&サポート部品

Featuring advanced image stitching capabilities, the OMQ series captures the complex contours of large lead frames and wafers, ensuring the precise alignment and dimensional integrity of foundational layers.

半導体相互接続

It strictly measures critical parameters such as pin coplanarity (Z-axis) and pitch alignment to effectively prevent connectivity failures.

3c ハードウェア
バッテリー
カッター
型抜き
携帯電話カメラ
携帯電話ガラス
プリント基板
Rfidタグ
シムカードスロット
スペース・ダスト・シールド
プレス部品

医療用射出成形消耗品

The system rapidly measures rubber stoppers and O-rings for dimensional accuracy without physical contact, maintaining the hygiene and shape of sterile consumables.

Medical Fasteners & Implants

It verifies the complex geometry of bone plates and the head profiles of surgical screws to meet rigorous medical manufacturing tolerances.

医療用電子部品

It provides high-precision inspection of dimensions for miniature sensors and MLCCs, ensuring consistency in sophisticated medical devices.

3c ハードウェア
バッテリー
カッター
型抜き
携帯電話カメラ
携帯電話ガラス
プリント基板
Rfidタグ
シムカードスロット
スペース・ダスト・シールド
プレス部品

ミリタリー精密ファスナー

The machine verifies Mil-Spec tolerances on aviation screws, specifically checking head dimensions and lengths to ensure absolute airworthiness.

軍事用光電子部品

It performs non-contact dimensional inspection on sensitive lenses and filters, preserving flawless optical performance without risk of damage.

軍用特殊素材部品

The system guarantees the structural consistency and dimensional accuracy of tungsten and ceramic parts designed for extreme thermal and kinetic environments.

製品パラメーター

モデルOMQ100COMQ120COMQ100D
Measuring Stroke (mm)82×55120×8082×55/20×13
Z-axis Movement ModeAutomaticAutomaticAutomatic
Optical LensDouble Telecentric Optical LensDouble Telecentric Optical LensDouble Telecentric Double-rate Optical Lens
Image Sensor (Pixels)20 Million20 MillionDual 20 Million
Measurement Accuracy (μm)±(2.5+L/50)±(2.5+L/50)±(2.5+L/50)
±(1.5+L/50)
Repeatability (μm)±1.5±1.5±1.5
±1.0
Light Source256-level Programmable Light Source
Contour Light: Telecentric Parallel Light
Surface Light: LED Ring Light256-level Programmable Light Source
Contour Light: Telecentric Parallel Light
Surface Light: LED Ring Light256-level Programmable Light Source
Contour Light: Telecentric Parallel Light
Surface Light: LED Ring Light
Image ProcessingIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing TechnologyIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing TechnologyIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing Technology
ソフトウェアIVT-VISIONIVT-VISIONIVT-VISION
Minimum Display Unit (mm)0.000010.000010.00001
Z-axis Movement Range (mm)454545
Z-axis Working Distance (mm)145145145
External Dimensions (mm)260×450×660280×480×680260×480×800
Weight (KG)284535
Load Capacity (KG)555
Working EnvironmentPower Supply: 220V/50Hz
Vibration: < 0.002mm/s, < 15Hz
Temperature: 22°C ±5°C
Humidity: 20~80%
Power Supply: 220V/50Hz
Vibration: < 0.002mm/s, < 15Hz
Temperature: 22°C ±5°C
Humidity: 20~80%
Power Supply: 220V/50Hz
Vibration: < 0.002mm/s, < 15Hz
Temperature: 22°C ±5°C
Humidity: 20~80%
Optional Accessories1. Customization available for special machine and software functions
2. Optional manual lifting workbench
3. Optional surface coaxial light
1. Customization available for special machine and software functions
2. Optional manual lifting workbench
3. Optional surface coaxial light
1. Customization available for special machine and software functions
2. Optional manual lifting workbench
3. Optional surface coaxial light

ビデオ

適合製品

詳細は専門家にお問い合わせください。

取得 お問い合わせ

ユナイトエコー・テクノロジー

UNITECHO株式会社は2013年に設立され、中国蘇州に本社を置く。マシンビジョンアル技術を核心とし、マシンビジョン、オートメーション、人工知能、その他の技術と産業アプリケーションを深く融合させることに力を注いでいる。研究開発、生産、販売、サービスに重点を置く新しいハイテク企業である。.

電話

+86-159-0216-9777

電子メール

uidi@unitecho.com

住所

臨湖路5号呉江区。呉江区。蘇州市。江蘇省

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