半導体相互接続光選別ソリューション

ホーム /
半導体相互接続光選別ソリューション

Precision Inspection for Semiconductor Interconnects

UNITECHOは、半導体コネクターに特化したAI搭載の外観検査ソリューションを提供し、すべてのピン、端子、複雑なリードフレームが最高水準の接続性と電気的完全性を満たしていることを保証します。UNITECHOのシステムは、ピンの変形、コプラナリティの問題、ピッチ偏差、メッキの異常、モールドフラッシュなどの重要な欠陥を検出するために、高速非接触検査を実行します。.

Utilizing advanced optical metrology and proprietary AI algorithms, we deliver precise and consistent quality control for high-density connector production. Our solution seamlessly integrates into manufacturing lines, providing real-time sorting and feedback to prevent parts with geometric inconsistencies from advancing. This prevents connection issues, reduces signal loss, and makes the final products more reliable, helping manufacturers reach zero-defect goals.

製品別ソリューション

光学選別機

Tailored for semiconductor connectors and terminals, our AI-driven optical sorting machines utilize Glass Plate and Six-sided inspection technologies. They perform high-speed, non-contact detection of micron-level defects such as lead deformation, plating peeling, and body cracks. By automatically identifying and separating non-conforming parts, the system ensures that only connectors with perfect structural integrity proceed to the next stage, preventing assembly issues caused by bent pins or damaged bodies.

光学測定機

This precision system is critical for connectors, delivering micron-level verification of geometric parameters including pin coplanarity, pitch alignment, and profile contours. Featuring advanced image stitching and large-field-of-view capabilities, it strictly measures complex tolerances to prevent connectivity failures. The machine provides real-time data feedback, ensuring every batch complies with rigorous semiconductor packaging standards before final assembly.

光学選別機

当社のAI搭載光学選別機は、高速・非接触検査を行い、自動車部品の表面キズ、寸法、材質の不一致による不良品を自動検出・選別します。.

光学測定機

この精密光学測定機は、重要部品の寸法検証や幾何学的解析にミクロンレベルの精度を提供し、自動車製造の厳しい公差への準拠を保証します。.

梱包機

当社の検査システムと統合された自動梱包機は、適格な自動車部品を効率的に仕分け、計数し、指定された容器に梱包し、最終生産段階を合理化します。.

梱包機

Integrated with visual counting technology, our automated packaging solutions are specialized for the bag-feeding of sensitive semiconductor connectors using anti-static pre-made pouches. It performs functions such as precise counting, foreign material detection, and hermetic sealing. This end-of-line automation protects connectors from electrostatic discharge (ESD) and physical damage, ensuring they are contamination-free and ready for immediate automated assembly.