Macchina di misura ottica per giunzioni

Ridefinire la misurazione su larga scala con la giunzione intelligente

Movimento automatizzato della piattaforma, un enorme sensore da 20 milioni di pixel e un'illuminazione flessibile per misurare con precisione componenti di grandi dimensioni. Adatto a requisiti di ispezione estesi con corse fino a 500×400×200 mm (OMQ542). Scoprite la potenza della serie OMQ Splice: combina l'analisi IVT-VISION con un'ottica a doppia telecentricità per una precisione priva di distorsioni e al di sotto del pixel su tutto lo stage.

✅ Sensore ad alta risoluzione da 20MP e doppio obiettivo telecentrico

✅ Ampio campo di misura (XYZ) con movimento automatico della tavola

✅ Elevata precisione statica (±2,0μm) con profilatura laser 3D opzionale

Condividi: il tuo nome.

Vantaggi del software

Rapid Multi-Dimensional Measurement

The IVT-VISION software drastically reduces inspection time by measuring over 100 dimensions simultaneously in under 1 second. Unlike traditional methods, adding measurement points does not increase the cycle time, ensuring maximum throughput for high-volume production efficiency.

Intuitive Operation for Everyone

Designed with a user-friendly interface, the OMQ series allows any operator to achieve stable, consistent results with a simple click. Clear on-screen guidance simplifies the setup process, eliminating the need for specialized training or complex manual adjustments.

Automated Data Management & Reporting

Measurement data is automatically saved and organized for centralized management, ensuring full traceability and easy retrieval. With a single click, users can generate detailed inspection reports, streamlining post-measurement workflows and significantly improving administrative efficiency.

No Fixturing or Precise Positioning Required

The system utilizes advanced pattern recognition to automatically detect the shape, position, and orientation of the workpiece. This eliminates the need for time-consuming alignment or expensive fixtures—simply place the part on the stage, and the software handles the rest.

Elimination of Focus-Related Errors

Featuring a large depth-of-field telecentric lens and auto-focus capabilities, the system handles uneven surfaces and height variations with ease. This technology eliminates deviations caused by manual focus adjustments, ensuring consistent accuracy regardless of the operator's skill level.

Scenari d'uso

Hardware 3c
Batteria
Taglierina
Fustellatura
Fotocamera del telefono cellulare
vetro del telefono cellulare
PCB
Tag RFID
Sim caerd slot
scudo antipolvere spaziale
Primavera
Parte di stampaggio

Parti di stampaggio per il settore automobilistico

The OMQ series is the perfect solution for verifying hole position deviations and profile contours on flat metal parts, ensuring precise fit and structural integrity in body and chassis components.

Componenti in gomma e guarnizioni per il settore automobilistico

The non-contact splicing capability is perfect for measuring large, flexible components like engine head gaskets or panoramic sunroof seals, identifying dimensional instability without causing physical deformation to the soft material.

Parti in plastica e componenti strutturali per autoveicoli

This solution is widely used for inspecting larger injection-molded interior panels or dashboard components, accurately detecting warpage and verifying critical assembly dimensions across the entire part

Hardware 3c
Batteria
Taglierina
Fustellatura
Fotocamera del telefono cellulare
vetro del telefono cellulare

Componenti strutturali dell'elettronica

The system is essential for verifying flatness, hole positions, and profile contours on larger structural components such as smartphone mid-frames, tablet backplates, and laptop keyboards, guaranteeing the structural integrity required for slim, high-density devices.

Hardware 3c
Batteria
Taglierina
Fustellatura
Fotocamera del telefono cellulare
vetro del telefono cellulare
PCB
Tag RFID
Sim caerd slot
scudo antipolvere spaziale
Primavera
Parte di stampaggio

Wafer e componenti di supporto per semiconduttori

Utilizing advanced image stitching technology, the OMQ Splice Series captures the complex contours of large-format wafers, lead frames, and PCB substrates, ensuring the precise alignment and dimensional integrity of these foundational layers which exceed standard field-of-view limits.

Parametri del prodotto

ArticoloOMQ322OMQ432OMQ542
ModelloOMQ322OMQ432OMQ542
Measuring Stroke XYZ (mm)300×200×200400×300×200500×400×200
Machine Movement ModeAutomaticAutomaticAutomatic
Single Field of View Measurement Range (mm)82×5582×5582×55
Optical LensDouble Telecentric Optical LensDouble Telecentric Optical LensDouble Telecentric Optical Lens
Image Sensor (Pixels)20 Million20 Million20 Million
Platform Moving Measurement Accuracy (μm)±(3.0+L/200)±(3.0+L/200)±(3.0+L/200)
Platform Non-Moving Measurement Accuracy (μm)±2.0±2.0±2.0
Repeatability (μm)±2.0±2.0±2.0
Light Source256-level Programmable Light Source; Contour Light: Telecentric Parallel Light; Surface Light: LED Ring Light/Coaxial Light256-level Programmable Light Source; Contour Light: Telecentric Parallel Light; Surface Light: LED Ring Light/Coaxial Light256-level Programmable Light Source; Contour Light: Telecentric Parallel Light; Surface Light: LED Ring Light/Coaxial Light
Image ProcessingIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing TechnologyIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing TechnologyIVT Advanced Image Analysis Method, 256 Gray Levels, 20:1 Sub-pixel Processing Technology
SoftwareIVT-VISIONIVT-VISIONIVT-VISION
Minimum Display Unit (mm)0.000010.000010.00001
Overall Dimensions (mm)1150×680×17001170×700×17071353×886×1707
Weight (KG)260300400
Load Capacity (KG)202020
Working EnvironmentPower Supply: 220V/50Hz; Vibration: <0.002mm/s, <15Hz; Temperature: 22°C±5°C; Humidity: 20~80%Power Supply: 220V/50Hz; Vibration: <0.002mm/s, <15Hz; Temperature: 22°C±5°C; Humidity: 20~80%Power Supply: 220V/50Hz; Vibration: <0.002mm/s, <15Hz; Temperature: 22°C±5°C; Humidity: 20~80%
Optional Accessories1. Customization of special models and software functions is available; 2. Optional laser measurement for 3D dimensions; 3. Optional low-angle automatic lifting zoned light source1. Customization of special models and software functions is available; 2. Optional laser measurement for 3D dimensions; 3. Optional low-angle automatic lifting zoned light source1. Customization of special models and software functions is available; 2. Optional laser measurement for 3D dimensions; 3. Optional low-angle automatic lifting zoned light source

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Ottenere Richiesta

Tecnologia Unitecho

UNITECHO Co., Ltd. è stata fondata nel 2013 e ha sede a Suzhou, in Cina. Con la tecnologia Al di visione artificiale come fulcro, si impegna a integrare profondamente visione artificiale, automazione, intelligenza artificiale e altre tecnologie con applicazioni industriali. È una nuova impresa high-tech che si concentra su R&S, produzione, vendita e assistenza.

Telefono

+86-159-0216-9777

Indirizzo

No.5 Linghou Road. Zona ad alta tecnologia di Fenhu. Distretto di Wujiang. Città di Suzhou. Provincia di Jiangsu

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