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Semiconductor Packaged Devices Optical Sorting Solution

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Precision Inspection for Semiconductor Packaged Devices

UNITECHO provides specialized AI-powered visual inspection solutions for semiconductor packaged components, ensuring every IC, chip, and discrete device meets the highest standards of precision and electrical integrity. Our systems perform high-speed, non-contact inspections to detect critical defects such as package cracks, lead deformations, electrode damage, oxidation, and micron-level surface inconsistencies.

Utilizing advanced Six-sided Appearance Sorting technology and proprietary AI algorithms, we deliver precise and consistent quality control for high-volume micro-component lines. Our solution seamlessly integrates into the backend supply chain, providing real-time sorting and feedback to prevent defective parts from reaching final assembly. This eliminates sorting errors, maximizes yield rates, and enhances the overall reliability of the final electronic device, supporting manufacturers in achieving zero-defect fabrication goals.

Tailored Solutions by Product

Optical Sorting Machine

Tailored for packaged components like ICs and discrete devices, our AI-driven optical sorting machines utilize Six-sided and Glass Plate inspection technologies. They perform high-speed, non-contact detection of micron-level defects such as package cracks, lead deformations, and electrode oxidation. By automatically separating non-conforming parts, the system ensures zero-defect delivery for critical semiconductor parts, preventing electrical failures in downstream assembly.

Relevant Introduction

sorting machine

Optical Sorting Machine

measuring machine

Optical Measuring Machine

counting machine

Optical Counting Machine

packing machine

Packing Machine

Optical Counting Machine

Replacing traditional weighing methods, our high-precision optical counting machine offers non-contact quantification for fragile bulk packaged components like chips. It utilizes advanced vision technology to eliminate static damage risks and ensures 100% counting accuracy. This is essential for high-value semiconductor inventory management, preventing quantity discrepancies and physical stress often caused by mechanical counters.

Relevant Introduction

Optical Sorting Machine

Optical Sorting Machine

Our AI-powered optical sorting machine performs high-speed, non-contact inspection to automatically detect and separate defective automotive components by surface flaws, dimensions, or material inconsistencies.
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Optical Measuring Machine

Optical Measuring Machine

This precision optical measuring machine delivers micron-level accuracy for dimensional verification and geometric analysis of critical parts, ensuring compliance with strict automotive manufacturing tolerances.
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Packing Machine

Packing Machine

Integrated with our inspection systems, the automated packing machine efficiently sorts, counts, and packages qualified automotive parts into designated containers, streamlining the final production stage.
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Packing Machine

Packing Machine

Integrated with our inspection systems, the automated packing machine efficiently sorts, counts, and packages qualified automotive parts into designated containers, streamlining the final production stage.
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Packing Machine

Integrated with visual counting technology, our automated packaging solutions are specialized for the anti-static bagging of sensitive semiconductor components. From pre-made pouches to final kitting, they ensure precise quantity control and contamination-free sealing. This streamlines the final stage of the semiconductor supply chain, protecting packaged components from environmental degradation and electrostatic discharge (ESD) during transport.

Relevant Introduction

Optical Sorting Machine

Optical Sorting Machine

Utilizing AI vision, this machine automatically sorts components by properties or defects, enhancing efficiency and consistency in electronics and automotive production.
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Optical Counting Machine

Optical Counting Machine

Replacing traditional weighing with line-scan CCD technology, this machine delivers 99.9% accuracy, ensuring exact quantities for hardware, pharmaceuticals, and food packaging.
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Packing Machine

Packing Machine

This intelligent, vision-guided system automates sorting and packaging while integrating final inspection to ensure quality and streamline end-of-line processes.
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Unitecho Technology

UNITECHO Co., Ltd. was founded in 2013 and is headquartered in Suzhou, China. With machine vision Al technology as its core, it is committed to deeply integrating machine vision, automation, artificial intelligence and other technologies with industry applications. It is a new high-tech enterprise focusing on R&D, production, sales and service.

Phone

+86-159-0216-9777

Email

uidi@unitecho.com

Address

No.5 Linghou Road. Fenhu High-tech Zone. Wujiang District. Suzhou City. Jiangsu Province

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